PCB Inspection System
* Information in this page is a reference that you created on the basis of information in the product catalog before the end of production, may be different from the current situation, such as goods for / supported standards options / price / features of the product. Before using, please check the compatibility and safety system.
last update: January 15, 2018
New series VT-S730-H makes inspection time about 2 times faster than the conventional one in our company with a new high-speed imaging module, and realizes high quality and high productivity at the same time.
ISO/TS16949 requires statistical surveys to analyze the differences of each measurement value.
VT-S730-H has MSA(Measurement System Analysis), which is a method to quantitatively evaluate them. It regularly measures and evaluates accuracy again and again by itself and leaves past records to keep the inspection accuracy.
The past records can be downloaded whenever it is necessary.
Solder shape reconstruction method of VT-S7 series has been developed more. It contributes more to quality control conforming to international standards such as ISO/TS16949 by improving accuracy of quantitative inspection for solder bondability.
By specifying height of objects in the inspection standards, objects of the height can be detected.
last update: January 15, 2018