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OMRON IA Global

 
Application Solutions

Shape Validation for Molded Parts

 

Calculation of the measured values can be carried out and the difference in level can be easily measured by just connecting the calculating unit between two amplifiers. Even if the surface conditions of a molded part varies, application of a line beam and HSDR-CMOS image sensor results in almost no fluctuation in measured value.

 

 

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Applicable Product


ZX2 Laser Sensor (CMOS Type)

Laser Sensor (CMOS Type)

 

 

ZX2

>> View other applications of ZX2

 
 

Other Applications

 Tray Warping Measurement before Chip Baking

 Wafer Thickness Measurement

 Detecting Shiny/Mirror Transparent Film

 

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